Leadframe for semiconductor devices

Details Leadframe for semiconductor devices Leadframe for semiconductor devices

1994-09-19

1997-04-22

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With dam or vent for encapsulant

257669, 257674, 257787, H01L 23495, H01L 2328

Patent

active

056231636

ABSTRACT:
A leadframe for semiconductor derides having patterned die-mounting structures arranged along the longitudinal axis of the leadframe. Each of the structures contains a die pad for mounting a semiconductor device chip thereon, die pad supports for supporting the die pad, fingers for forming inner leads and outer leads, and tiebars for preventing leakage of a molding material during a molding process. At least one of the die pad supports has a first communication path through which a molding material flows from one side of the body to the other thereof. The molding material supplied into one side of the leadframe can flow to the other side thereof through not only the gaps between the die pad and the body but also the first communication path during a molding process, resulting in a small flow rate difference of the molding material. Failures such as visible voids and no fillings are not produced in the plastic-molding package.

REFERENCES:
patent: 4803544 (1989-02-01), Holzschuh et al.
patent: 4862246 (1989-08-01), Masuda et al.
patent: 4868635 (1989-09-01), Frechette et al.
patent: 4894704 (1990-01-01), Endo
patent: 5150194 (1992-09-01), Brooks et al.

Affiliated with

Also associated with

Rating

Leadframe for semiconductor devices does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe for semiconductor devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe for semiconductor devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-343511