Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2011-03-08
2011-03-08
Graybill, David E (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
active
07902649
ABSTRACT:
A leadframe employed by a leadless package comprises a plurality of package units and an adhesive tape. Each of the package units has a die pad with a plurality of openings and a plurality of pins disposed in the plurality of openings. The adhesive tape is adhered to the surfaces of the plurality of package units and fixes the die pad and the plurality of pins.
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Chou Shih Wen
Lin Chun Ying
Pan Yu Tang
Shen Geng Shin
ChipMOS Technologies Inc.
Graybill David E
King Anthony
WPAT, P.C.
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