Leadframe having die attach pad with delamination and...

Details Leadframe having die attach pad with delamination and... Leadframe having die attach pad with delamination and...

2007-12-18

2010-10-05

Chu, Chris (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257SE23043, C257S666000, C257S667000, C438S106000

Reexamination Certificate

active

07808089

ABSTRACT:
One aspect of the invention pertains to a semiconductor package having a die and a die attach pad with a plurality of spaced apart pedestals supported by a web. A die is mounted on the die attach pad such that the die is supported by at least a plurality of the pedestals. Selected edge regions of the die are arranged to overlie recessed regions of the die attach pad between adjacent pedestals. The die is electrically connected to at least some of the contact leads. An adhesive is arranged to secure the die to the die attach pad, with the thickness of the adhesive between the web of the die attach pad and the die being greater than the thickness of the adhesive between the die and the top surfaces of the pedestals that support the die. The die attach pad may have rounded peripheral corners between adjacent edge surfaces of the die attach pad. In another aspect of the invention, a method of packaging integrated circuits is described, wherein the resulting packages include at least some of the aforementioned leadframe structures.

REFERENCES:
patent: 4857989 (1989-08-01), Mori et al.
patent: 5053855 (1991-10-01), Michii et al.
patent: 5126820 (1992-06-01), Brown
patent: 5150193 (1992-09-01), Yasuhara et al.
patent: 5175610 (1992-12-01), Kobayashi
patent: 5397915 (1995-03-01), Nose
patent: 5578871 (1996-11-01), Fierkens
patent: 5750423 (1998-05-01), Ishii
patent: 5818103 (1998-10-01), Harada
patent: 5844306 (1998-12-01), Fujita et al.
patent: 5864174 (1999-01-01), Yamada et al.
patent: 5986333 (1999-11-01), Nakamura
patent: 6303985 (2001-10-01), Larson et al.
patent: 6306684 (2001-10-01), Richardson et al.
patent: 6329706 (2001-12-01), Nam
patent: 6388311 (2002-05-01), Nakashima et al.
patent: 6437427 (2002-08-01), Choi
patent: 6498392 (2002-12-01), Azuma
patent: 6504238 (2003-01-01), Cheng et al.
patent: 6639306 (2003-10-01), Huang
patent: 6653720 (2003-11-01), Kameda
patent: 6661083 (2003-12-01), Lee et al.
patent: 6683368 (2004-01-01), Mostafazadeh
patent: 6703696 (2004-03-01), Ikenaga et al.
patent: 6713849 (2004-03-01), Hasebe et al.
patent: 6750546 (2004-06-01), Villanueva et al.
patent: 6849933 (2005-02-01), Koike et al.
patent: 6891254 (2005-05-01), Taniguchi
patent: 7001798 (2006-02-01), Yamaguchi
patent: 7030505 (2006-04-01), Kimura
patent: 7042068 (2006-05-01), Ahn et al.
patent: 7145222 (2006-12-01), Gai
patent: 7250685 (2007-07-01), Shim et al.
patent: 7262491 (2007-08-01), Islam et al.
patent: 7399658 (2008-07-01), Shim et al.
patent: 7443015 (2008-10-01), Punzalan et al.
patent: 2005/0236701 (2005-10-01), Minamio et al.
patent: 2007/0075404 (2007-04-01), Dimaano, Jr. et al.
U.S. Appl. No. 11/372,481, filed Mar. 8, 2006.
U.S. Appl. No. 60/971,997, filed Sep. 13, 2007.
U.S. Appl. No. 11/869,709, filed Oct. 9, 2007.
U.S. Appl. No. 11/869,708, filed Oct. 9, 2007.
Office Action dated Jun. 17, 2010 from U.S. Appl. No. 12/167,163.

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