Leadframe having resilient carrier positioning means

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

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Details

257676, 257797, 257672, 257669, H01R 4300

Patent

active

059201142

ABSTRACT:
The present invention relates to an improved leadframe and method of attaching leads of a leadframe to contact pads on a carrier. The leadframe includes resilient engaging means or fingers for engaging the carrier and for exerting forces on the carrier to thereby support the carrier and accurately position and align the contact pads on the carrier with the leads. This invention overcomes the expense and inaccuracies of known leadframe designs and techniques in attaching leads to carrier contact pads using such things as fixtures for positioning the leadframe and carrier, visual alignment procedures and retaining tabs.

REFERENCES:
patent: 4089575 (1978-05-01), Grabbe
patent: 4763409 (1988-08-01), Takekawa et al.

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