Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With dam or vent for encapsulant
Patent
1991-02-06
1993-04-13
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With dam or vent for encapsulant
257666, H01L 2348, H01L 2354
Patent
active
052025772
ABSTRACT:
A leadframe comprising a thin-walled portion that is formed in a dam bar portion or a portion that extends from the dam bar portion to a pair of inner leads which are adjacent thereto. By cutting the dam bar portion along the thin-walled portion, the stress that is imposed on a cutting punch is reduced. Thus, it is possible to extend the lifetime of the cutting punch and also to minimize the shear droop formed on the cut surface. The leadframe further has a thick-walled portion formed at the position where the thin-wall portion is formed. The thick-walled portion serves to support the thin-walled portion when the dam bar portion is cut off, thus preventing the dam bar portion from tilting. Accordingly, the dam bar cutting operation can be conducted stably without undesired movement of the dam bar portion, and the stress that is imposed on the leadframe can be controlled so as to be well balanced.
Fuse Masahiro
Ichigi Kikuo
Shimamura Soichiro
Clark S. V.
Dai Nippon Printing Co. Ltd.
Hille Rolf
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