Leadframe for use in a semiconductor package

Details Leadframe for use in a semiconductor package Leadframe for use in a semiconductor package

2004-10-13

2008-10-07

Pert, Evan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S734000, C257S750000, C257S766000, C257SE23031, C257SE23053

Reexamination Certificate

active

07432584

ABSTRACT:
A leadframe comprises a die mounting area, a plurality of lead fingers and a metal deposit having a negative electrochemical potential with respect to a standard H2half cell. A semiconductor package comprises the leadframe and a semiconductor chip having a plurality of contact areas mounted to the die mounting area and electrically connected to the inner ends of the lead fingers of the leadframe by a plurality of bond wires. The semiconductor chip, the bond wires and inner portions of the lead fingers are encapsulated by a plastic housing.

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