Leadframe having exposed, solderable outer lead ends

Details Leadframe having exposed, solderable outer lead ends Leadframe having exposed, solderable outer lead ends

1995-05-24

1996-10-08

Whitehead, Jr., Carl

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257736, 257750, 257762, 257763, 257765, 257766, 257767, H01L 23495, H01L 2348, H01L 2352, H01L 2940

Patent

active

055634427

ABSTRACT:
There is disclosed a leadframe for electrically interconnecting a semiconductor device to external circuitry. The leadframe has an electrically conductive substrate that is coated with an oxidation resistant external layer. An intervening layer is disposed between a portion of the substrate and the external layer. The intervening layer is absent from the outer lead ends of the leadframe. Subsequent removal of the external layer from the outer lead ends enables a solder to directly contact the leadframe substrate.

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