Leadframe having continuously reducing width and semiconductor d

Details Leadframe having continuously reducing width and semiconductor d Leadframe having continuously reducing width and semiconductor d

1998-02-02

1999-08-03

Chaudhuri, Olik

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

H01L 23495

Patent

active

059329246

ABSTRACT:
A leadframe (100) has a flag having an outer contour that tapers from first and second opposing ends (160, 162) to a common point, the midline (200) of the flag. The tapering of the leadframe is continuous, extending from points adjacent the first and second ends or from the ends themselves, to the common midline. According to this structure, a wide range of die sizes may be accommodated with a single leadframe, while simultaneously preventing popcorning of the packaged semiconductor device (300) incorporating the leadframe.

REFERENCES:
patent: 4797726 (1989-01-01), Manabe
patent: 5233222 (1993-08-01), Djennas et al.

Affiliated with

Also associated with

Rating

Leadframe having continuously reducing width and semiconductor d does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Leadframe having continuously reducing width and semiconductor d, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Leadframe having continuously reducing width and semiconductor d will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-852094