Leadframe for semiconductor chips and semiconductor module havin

Details Leadframe for semiconductor chips and semiconductor module havin Leadframe for semiconductor chips and semiconductor module havin

1997-07-23

2000-11-07

Williams, Alexander O.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257696, 257698, 257667, 257674, 257670, H01L 2350, H01L 2328, H01L 2348, H01L 2944

Patent

active

061440884

ABSTRACT:
A leadframe for connection to a semiconductor chip, in particular a metal leadframe, includes a plurality of lead prongs and at least two raised lead surfaces. When a semiconductor module that includes the leadframe and a semiconductor chip is sheathed with plastic, the raised lead surfaces assure a uniform flow of a plastic composition in a mold cavity and thus prevent air from becoming trapped in a plastic package. The lead surfaces are preferably created by folding over tabs in the leadframe. The invention also relates to preliminary stages of the leadframe and to semiconductor components that contain the leadframe of the invention.

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patent: 6043430 (2000-03-01), Chun

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