Leadframe having metal impregnated silicon carbide mounting area

Details Leadframe having metal impregnated silicon carbide mounting area Leadframe having metal impregnated silicon carbide mounting area

1995-02-01

1996-06-18

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257677, 257787, H01L 23495

Patent

active

055280765

ABSTRACT:
A leadframe (10) formed by a method including providing a preform of silicon carbide, placing the preform in a mold, injecting a liquefied metal, such as aluminum, into the mold to fill the mold and infiltrate the preform, using heat and pressure. The mold defines a mounting area (12) in which the preform is positioned, and a plurality of leads (20, 22, 28, 29).

REFERENCES:
patent: 5014113 (1991-05-01), Casto
"Metal Matrix Composites for Electronic Packaging" by Carl Zweber JOM, vol. 44 Iss. 7 pp. 15-23 Jul. 1992.

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