Leadframe having contact pads defined by a polymer insulating fi

Details Leadframe having contact pads defined by a polymer insulating fi Leadframe having contact pads defined by a polymer insulating fi

1994-12-30

1997-03-04

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257669, 257677, H01L 23495

Patent

active

056082606

ABSTRACT:
A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.

REFERENCES:
patent: 4883774 (1989-11-01), Djennas et al.
patent: 5072280 (1991-12-01), Matsukura
patent: 5086018 (1992-02-01), Conru et al.
patent: 5424578 (1995-06-01), Fujita et al.
S. J. Krumbein, "Metallic Electromigration Phenomena" IEEE Transactions on Components, Hybrids, and Manufacturing Technology, vol. 11, No. 1, Mar. 1988, pp. 5-15.
E. J. Dombroski et al., "Thin Small Outline Packages", IBM Technical Disclosure Bulletin, vol. 34, No. 1, Jun. 1991, pp. 358-359.

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