LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Balanced capacitance lead frame for integrated circuits and inte

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Balanced semiconductor device packages including lead frame...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array package with lead frame

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With stress relief

Ball grid array semiconductor package comprised of two lead...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars

Ball grid array substrate strip with warpage-preventive...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array type of semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array type semiconductor package having a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array type semiconductor package having a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Ball grid array type semiconductor package having a flexible...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Base of LED

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Bent lead transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With heat sink means

Bent tip method for preventing vertical motion of heat spreaders

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board

BGA package and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

BGA package having half-etched bonding pad and cut plating...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

BGA type semiconductor device having a solder-flow...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Board for manufacturing a BGA and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Bonding pad design for impedance matching improvement

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame

Bonding support for leads-over-chip process

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Bottom lead frame and bottom lead semiconductor package using th