Bent lead transistor

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame

Reexamination Certificate

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Details

C257SE23043, C257SE23066, C257S675000, C257S712000, C257S713000, C257S717000, C257S670000, C257S671000, C257S672000, C257S674000, C257S666000, C257S696000, C257S707000, C257S698000, C257S690000

Reexamination Certificate

active

07466016

ABSTRACT:
A metal backing tab supports the semiconductor device and has an extending portion extending from an edge. A top leg, a middle leg and a bottom leg are all coupled to the semiconductor device and each has a lead terminal portion extending beyond the boundary of said molded housing. The top leg has a first top leg section that protrudes directly away from the molded housing, a second top leg section that bends toward a direction of a face of the molded housing, and a third top leg section bending downward. The middle leg has a first middle leg section connected to the package that protrudes away from the molded housing, and a middle leg downward section that points downward. The bottom leg has a first bottom leg section that protrudes away from the molded housing face, a second bottom leg section that points away from the molded housing face, and third bottom leg section that points downward.

REFERENCES:
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patent: 3778887 (1973-12-01), Suzuki et al.
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patent: 5276352 (1994-01-01), Komenaka et al.
patent: 5581118 (1996-12-01), Mays
patent: 5825794 (1998-10-01), Ogino et al.
patent: 5998856 (1999-12-01), Noda et al.
patent: 6008074 (1999-12-01), Brand
patent: 6107676 (2000-08-01), Suzuki
patent: 6114750 (2000-09-01), Udagawa
patent: 6577503 (2003-06-01), Kinsman et al.
patent: 6977432 (2005-12-01), Crane et al.

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