Board for manufacturing a BGA and method of manufacturing...

Details Board for manufacturing a BGA and method of manufacturing... Board for manufacturing a BGA and method of manufacturing...

2005-12-13

2005-12-13

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S738000, C438S459000

Reexamination Certificate

active

06975022

ABSTRACT:
A device containing a flat member is provided, having a pattern for a bonding pad, a wiring, and an electrode, by half-etching through the flat member.

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CSP Technology, and mounting material and device supporting the technology-special issue of Denshi Zairyo.

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