Balanced capacitance lead frame for integrated circuits and inte

Details Balanced capacitance lead frame for integrated circuits and inte Balanced capacitance lead frame for integrated circuits and inte

1992-02-24

1993-08-03

LaRoche, Eugene R.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257670, 257676, 257783, 257784, 257787, H01L 2348

Patent

active

052332209

ABSTRACT:
A lead frame (10) is connected over an integrated circuit (40) by adhesives (42) and (44). Each lead conductor (16) and (18) of the lead frame (10) has the identical geometric area in order to provide identical capacitances. A metal shield may be provided on adhesives (42) and (44) to provide noise shielding for the integrated circuit (40).

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Volume Production of Unique Plastic Surface-Mount Modules for the IBM 80-ps 1-Mbit DRAM Chip by Area Wire Bond Techniques by W. C. Ward, IEE article. (1988).

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