Ball grid array package with lead frame

Details Ball grid array package with lead frame Ball grid array package with lead frame

1995-10-17

1997-09-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257738, 257778, H01L 23495

Patent

active

056635931

ABSTRACT:
A ball grid array (BGA) package incorporates a lead frame which includes a die attach pad and a plurality of leads radiating away from the die attach pad. A die is mounted on the die attach pad and electrically connected to the leads by wire bonding. A non-conductive solder mask or tape is applied to the lead frame which defines a number of selectively positioned vias (openings). A molded plastic casing or a cap is positioned over the die, wiring and lead frame to encapsulate the package. Solder balls or columns are attached to selected leads of the lead frame through the vias.

REFERENCES:
patent: 5403776 (1995-04-01), Tsuji et al.
patent: 5409865 (1995-04-01), Karnezos

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