Ball grid array type of semiconductor device

Details Ball grid array type of semiconductor device Ball grid array type of semiconductor device

1995-11-15

1997-09-02

Thomas, Tom

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

257676, 257737, 257738, 257778, H01L 23495

Patent

active

056635940

ABSTRACT:
A ball grid type of semiconductor device is provided which includes a semiconductor chip having a plurality of electrode pads. In one preferred embodiment, the semiconductor chip is adhered to a plurality of corresponding planar metal leads via an insulator. The plurality of electrode pads and the plurality of corresponding metal leads are bonded by wires. The semiconductor chip and the plurality of metal leads are sealed together with the wires with a material. A predetermined number of holes passing through the seal to the plurality of metal leads are formed by a laser beam or a drill. Then, solder bails are melted to connect each of the solder balls to a corresponding one of the plurality of metal leads. Finally, the plurality of metal leads are cut at the outer surface of the seal.

REFERENCES:
patent: 4937656 (1990-06-01), Kohara
patent: 5216278 (1993-06-01), Lin et al.
patent: 5293072 (1994-03-01), Tsuji et al.

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