Balanced semiconductor device packages including lead frame...

Details Balanced semiconductor device packages including lead frame... Balanced semiconductor device packages including lead frame...

2006-11-29

2011-12-27

Potter, Roy K (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S676000, C257SE23037

Reexamination Certificate

active

08084846

ABSTRACT:
A semiconductor device assembly or package includes at least one semiconductor device that is positioned adjacent to floating leads. Such an assembly or package may include at least two semiconductor devices that face opposite directions from one another, with each being oriented such that bond pads thereof are at an opposite side of the assembly or package from bond pads of the other. Alternatively, an assembly or package may include a lead assembly with an internal portion, including one or more floating leads, and an external portion that are in planes that are offset relative to one another. Methods for designing lead frames, assemblies, and packages are also disclosed, as are assembly and packaging methods.

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patent: 6476474 (2002-11-01), Hung
patent: 6552416 (2003-04-01), Foster
patent: 7408245 (2008-08-01), Hung et al.
patent: 7728411 (2010-06-01), Lee et al.
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patent: 2004/0164392 (2004-08-01), Lee
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Singapore Search Report for Singapore Application No. 2007002660 dated Jul. 13, 2010, 8 pages.
Singapore Written Opinion for Singapore Application No. 2007002660 dated Jul. 14, 2010, 14 pages.

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