Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-03-08
2005-03-08
Baumeister, Bradley (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S675000, C257S722000, C361S707000, C361S709000, C361S710000, C361S717000
Reexamination Certificate
active
06864567
ABSTRACT:
A base of LED includes a negative pole seat and a positive pole seat. The negative pole seat is made of conductive material with a flat negative pole plate at a lower outer side thereof, an integral negative pole body at an inner side thereof, multiple upright negative pole seat grooves at two lateral sides thereof and a negative pole recess at the top thereof respectively. The positive pole seat also is made of conductive material with a flat positive pole plate at the lower outer side thereof, an integral positive pole body at the inner side thereof, multiple seat grooves extending upright from the bottom at two lateral sides thereof. A crystal grain is located at the negative pole recess and a connecting wire at both ends thereof joined to the positive pole seat and the crystal grain and the negative pole plate and the positive pole plate are adhered to circuit of a circuit board to form a close circuit.
REFERENCES:
patent: 3676668 (1972-07-01), Collins et al.
patent: 6407411 (2002-06-01), Wojnarowski et al.
patent: 6561680 (2003-05-01), Shih
patent: 6583447 (2003-06-01), Wang et al.
patent: 6710373 (2004-03-01), Wang
Baumeister Bradley
Troxell Law Office PLLC
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