Back-to-back connected power semiconductor device package

Details Back-to-back connected power semiconductor device package Back-to-back connected power semiconductor device package

2005-02-22

2005-02-22

Thomas, Tom (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

C257S670000, C257S671000, C257S685000, C257S686000, C257S689000, C257S777000, C257S787000, C361S760000, C438S108000, C438S109000

Reexamination Certificate

active

06858922

ABSTRACT:
A small footprint package for two or more semiconductor die includes first and second die, mounted on opposite respective surfaces of a lead frame pad in vertical alignment with one another. A conductive or insulation adhesive can be used. The die can be identical MOSgated devices connected in series, or can be one power die and a second IC die for the control of the power die.

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