Bottom lead frame and bottom lead semiconductor package using th

Details Bottom lead frame and bottom lead semiconductor package using th Bottom lead frame and bottom lead semiconductor package using th

1997-12-17

2000-09-12

Picard, Leo P.

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With structure for mounting semiconductor chip to lead frame

257666, 257668, 257692, 257696, H01L 23495, H01L 2350

Patent

active

061181749

ABSTRACT:
A bottom lead frame and a bottom lead semiconductor package embodying the invention are capable of forming a multiple row pin structure. The bottom lead frame includes a plurality of first leads, and a plurality of second leads, where each lead has a bottom lead portion and an inner lead portion that is upwardly bent from the bottom lead portion. The first leads and second are arranged on opposite sides of a central portion. Each of the first leads is inserted between a pair of neighboring second leads. The bottom portions of the second leads are arranged outwardly of the bottom portions of the first leads. A lead support bar may be connected to the inner portions of the first and second leads to support the first and second leads. A semiconductor chip may be mounted on upper surfaces of either the first or the second leads.

REFERENCES:
patent: 5428248 (1995-06-01), Cha
patent: 5606199 (1997-02-01), Yoshigai
patent: 5770888 (1998-06-01), Song et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5824950 (1998-10-01), Mosley et al.
patent: 5926376 (1999-07-01), Cho

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