LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Vertical surface mount package utilizing a back-to-back...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Vertical system integration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Vertical system integration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Vertically integrated component assembly incorporating active an

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Vertically integrated semiconductor configuration

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Vertically mountable and alignable semiconductor device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Vertically mountable and alignable semiconductor device,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Vertically mountable and alignable semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Vertically mountable interposer assembly and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Vertically mountable interposer, assembly and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Vertically mountable semiconductor device and methods

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Vertically mountable semiconductor device, assembly, and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Vertically stacked memory chips in FBGA packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Vertically stacked pre-packaged integrated circuit chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Vertically stacked semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Very dense chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Outside periphery of package having specified shape or...

Very dense integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling

Very low magnetic field integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Very thin multi-chip package and method of mass producing...