Vertically integrated component assembly incorporating active an

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

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257724, 361766, H01L 2334, H05K 116

Patent

active

056708246

ABSTRACT:
An vertically-integrated electronic assembly containing integral passive components is combined with an integrated circuit creating a three-dimensional package. The electronic assembly is formed as a multi-layered structure having deposited passive components on a substrate layer. Contact pads for the passive components extend to an edge of the substrate layer and are exposed for contact with surrounding circuitry and with the combined integrated circuit.

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