Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2005-03-29
2005-03-29
Chambliss, Alonzo (Department: 2827)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S724000, C257S726000, C257S777000, C257S783000, C257S786000, C361S760000, C361S774000, C361S785000, C361S808000, C361S809000
Reexamination Certificate
active
06873037
ABSTRACT:
A back-to-back semiconductor device module including two semiconductor devices, the backs of each being secured to one another. The bond pads of both semiconductor devices are disposed adjacent a single, mutual edge of the device module. The device module may be secured to a carrier substrate in a substantially perpendicular orientation relative to the former. Solder reflow or a module-securing device can secure the device module to the carrier substrate. An embodiment of a module-securing device comprises an alignment device having one or more receptacles formed therein and intermediate conductive elements that are disposed within the receptacles to establish an electrical connection between the semiconductor devices and the carrier substrate. Another module-securing device comprises a clip-on lead, where one end resiliently biases against a lead of at least one of the semiconductor devices, while the other end connects electrically to a carrier substrate terminal.
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Chambliss Alonzo
Micro)n Technology, Inc.
TraskBritt
LandOfFree
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