LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally improved placement of power-dissipating components...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough

Thermally responsive compressive diode assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally-enhanced ball grid array package structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally-enhanced ball grid array package structure and method

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally-enhanced circuit assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Thermally-enhanced circuit assembly

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally-enhanced flip chip IC package with extruded heatspread

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermally-enhanced stacked-die ball grid array semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric 3D cooling

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric cooling device arrays

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric element and cooling or heating device provided wi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric module package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Thermoelectric module with interarray bridges

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Thick film copper metallization for microwave power transistor p

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Thick film hybrid multilayer circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device

Thick film millimeter wave transceiver module