Thermally responsive compressive diode assembly

Details Thermally responsive compressive diode assembly Thermally responsive compressive diode assembly

1996-06-06

1998-06-30

Tran, Minh-Loan

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Entirely of metal except for feedthrough

257718, 257724, 257727, 257925, H01L 2310

Patent

active

057738858

ABSTRACT:
A power rectifier has a diode blank sandwiched between a pair of contacts which apply progressive compressive loads upon the diode blank as the temperature of the diode assembly increases. Preferably, the contacts are formed from dissimilar metals having different thermal expansion characteristics and are operatively coupled such that the thermal expansion differential translates into the desired compressive load characteristic.

REFERENCES:
patent: 5302856 (1994-04-01), Narita et al.
Training Chart Manual; Delco Remy, Anderson, Indiana; 1962; pp. Chart 13; "Delcotron generator and the charging circuit".

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