Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2006-07-18
2006-07-18
Potter, Roy (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S713000
Reexamination Certificate
active
07078801
ABSTRACT:
A thermoelectric module package stores a thermoelectric module for controlling temperature of a semiconductor element (e.g., a semiconductor laser) having high output power, wherein it is constituted by a frame member and a base member, on which various electrode patterns are formed. That is, the base member has internal electrodes for establishing electrical connections with the semiconductor element and thermoelectric module, and external electrodes for establishing electrical connections with external circuitry. Due to such an integrated arrangement of electrode patterns on the base member, it is possible to reduce the number of parts required for manufacturing the thermoelectric module package, which can be therefore manufactured with ease and at a relatively low cost. Incidentally, the thermoelectric module package can be produced by integrally combining a frame and a base together.
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Copy of Japanese Office Action dated Jan. 17, 2006 (and English translation of relevant portion).
Dickstein Shapiro Morin & Oshinsky LLP.
Potter Roy
Yamaha Corporation
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