Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Patent
1993-01-29
1998-09-29
Nguyen, Viet Q.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
257684, 257700, 257701, 257702, 257690, 257688, 257712, H01L 2314
Patent
active
058148809
ABSTRACT:
A heat dissipating module and package for power microwave transistors and method of making same that includes a substrate having a thick copper layer bonded to a ceramic core which is thereto subjected to high processing temperatures.
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Buhay Harry
Costello John A.
Madia Gene A.
Papania Richard R.
Petrosky Kenneth J.
Nguyen Viet Q.
Northrop Grumman Corporation
Sutcliff Walter G.
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