Thermally-enhanced ball grid array package structure and method

Details Thermally-enhanced ball grid array package structure and method Thermally-enhanced ball grid array package structure and method

2007-02-20

2007-02-20

Whitehead, Jr., Carl (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257SE23101, C438S122000

Reexamination Certificate

active

10061507

ABSTRACT:
A thermally-enhanced ball grid array package structure is provided that includes an integrated circuit chip, a heat spreader and a substrate. The integrated circuit chip has a specified surface area. The heat spreader is coupled to the integrated circuit chip. The substrate is coupled to the heat spreader. The substrate has a specified surface area. The heat spreader covers a specified portion of the surface area of the substrate that is greater than the surface area of the integrated circuit chip. The heat spreader is operable to dissipate heat from the integrated circuit chip over the specified portion of the surface area of the substrate.

REFERENCES:
patent: 6057601 (2000-05-01), Lau et al.
patent: 6475327 (2002-11-01), Tung et al.
patent: 6577013 (2003-06-01), Glenn et al.
patent: 2001/0052647 (2001-12-01), Plepys et al.
patent: 2002/0040751 (2002-04-01), Hilton et al.
patent: 2002/0079572 (2002-06-01), Khan et al.
patent: 2002/0135065 (2002-09-01), Zhao et al.

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