Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1998-01-20
2000-09-05
Saadat, Mahshid
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257712, 257778, 257706, H01L 2334, H01L 2310, H01L 2348
Patent
active
061147613
ABSTRACT:
A thermally-enhanced flip chip integrated circuit (IC) package has a package substrate to which an IC die is bonded. A thermally-conductive heatspreader, having planar dimensions larger than the IC die, is thermally bonded at or near its center to an upper surface of the IC die. A plurality of cooling extensions are formed that protrude from a lower surface (the surface closest to the package substrate) of the heatspreader so as to create passageways through which cooling air may flow. In one embodiment, the cooling extensions are parallel fins that protrude transversely from the lower surface of the heatspreader, thereby forming U-shaped channels. In another embodiment, the cooling extensions are an array of fin pins that protrude transversely from the lower surface of the heatspreader.
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patent: 5559674 (1996-09-01), Katsu
patent: 5625229 (1997-04-01), Kojima et al.
patent: 5650662 (1997-07-01), Edwards et al.
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Celik Zeki Z.
Ghahghahi Farshad
Kutlu Zafer S.
Mertol Atila
Clark Jhihan B.
LSI Logic Corporation
Saadat Mahshid
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