Thermally improved placement of power-dissipating components...

Details Thermally improved placement of power-dissipating components... Thermally improved placement of power-dissipating components...

2005-06-07

2008-10-28

Tran, Minh-Loan (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257S706000, C257S707000, C257S724000, C257S777000, C257S778000, C257SE23051, C257SE23085, C257S685000

Reexamination Certificate

active

07443025

ABSTRACT:
The invention refers to an electronic system, comprising several power-dissipating components, and a circuit board, wherein said power-dissipating components are mounted both to a top side and a bottom side of said circuit board. Further, the invention refers to method for mounting power-dissipating components onto a circuit board, comprising the steps of (a) determining the thermal behavior of said power-dissipating components; and (b) determining, in accordance thereto, the placement of said power-dissipating components on both a top side and a bottom side of said circuit board.

REFERENCES:
patent: 5723907 (1998-03-01), Akram
patent: 5831890 (1998-11-01), Selna et al.
patent: 5973923 (1999-10-01), Jitaru
patent: 6127833 (2000-10-01), Wu et al.

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