Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2008-04-08
2008-04-08
Quach, T. N. (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S717000, C257SE23101, C257SE21511, C438S108000, C438S122000
Reexamination Certificate
active
11373703
ABSTRACT:
A circuit assembly for mounting one or more integrated circuits that effectively dissipates heat generated by the integrated circuits, and a corresponding method for fabricating such a circuit assembly. The circuit assembly comprises a substrate, a thermally-conductive adhesive layer and a heat-dissipating layer. The substrate includes an opening extending between a first surface and a second surface of the substrate. An integrated circuit is to be mounted on the first surface of the substrate substantially coincident with the opening. The thermally-conductive adhesive layer is at least partially disposed within the opening in the substrate. The heat-dissipating layer is disposed on the second surface of the substrate and includes a raised portion that at least partially extends through the opening in the substrate.
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Dobosz Stanislaw
Dunbar Mark R.
Lanciault Mark R.
Berger Derek J.
Maxtor Corporation
Quach T. N.
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