Thin, small-sized power semiconductor package
Thin, thermally enhanced flip chip in a leaded molded package
Thin-film heat sink and method of manufacturing same
Thinned die integrated circuit package
Three commonly housed diverse semiconductor dice
Three commonly housed diverse semiconductor dice
Three dimensional device integration method and integrated...
Three dimensional integrated circuit and method of making...
Three dimensional integrated circuits
Three dimensional package for monolithic microwave/millimeterwav
Three dimensional packaging configuration for multi-chip module
Three dimensional semiconductor package having flexible appendag
Three dimensional stack package device having exposed coupling l
Three-dimensional flexible assembly of integrated circuits
Three-dimensional memory card structure with internal direct chi
Three-dimensional memory stacking using anisotropic epoxy...
Three-dimensional module comprised of layers containing IC...
Three-dimensional multichip module
Three-dimensional multichip module
Three-dimensional multichip module