Thinned die integrated circuit package

Details Thinned die integrated circuit package Thinned die integrated circuit package

2005-01-11

2008-09-02

Le, Dung A. (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

C257S713000, C257SE23101, C257SE23107, C438S106000, C438S107000

Reexamination Certificate

active

07420273

ABSTRACT:
A method and apparatus provide an integrated circuit package with improved heat dissipation and easier fabrication. The integrated circuit package includes a thinned semiconductor die attached to a heat spreader using a thermally conductive material. The thinned die reduces the thermal resistance of the die/heat spreader combination to improve heat extraction from the die as well as eliminating processing steps in fabrication. Additionally, the thinned die becomes more compliant as it takes on the thermal/mechanical properties of the heat spreader to reduce stress-induced cracking of the die.

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