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Semiconductor package featuring metal lid member

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package for enhancing heat dissipation

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor package for improving the capability of spreading

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Semiconductor package for improving the capability of spreading

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Semiconductor package for memory chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Semiconductor package for multiple high power transistors

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Semiconductor package for radio frequency

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package for surface mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Semiconductor package for surface mounting

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Semiconductor package for surface mounting with reinforcing memb

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Semiconductor package for three-dimensional mounting,...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Semiconductor package free of substrate and fabrication...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package having a bridged plate interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Semiconductor package having a bridged plate interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Semiconductor package having a eutectic bonding layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Patent

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Semiconductor package having a ground or power ring and a metal

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Semiconductor package having a heat sink with an exposed...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Semiconductor package having a heat spreader capable of preventi

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Semiconductor package having a heat-activated source of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With desiccant – getter – or gas filling
Reexamination Certificate

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Semiconductor package having a plurality input/output members

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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