Semiconductor package having a plurality input/output members

Details Semiconductor package having a plurality input/output members Semiconductor package having a plurality input/output members

2004-10-25

2011-12-06

Im, Junghwa M (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S685000, C257S700000, C257S686000, C257S698000, C257S678000, C257S693000, C257SE23169

Reexamination Certificate

active

08072058

ABSTRACT:
A semiconductor package has a first substrate having a plurality of electrically conductive patterns formed thereon. A first semiconductor die is coupled to the plurality of conductive patterns. A second semiconductor die is coupled to the first semiconductor die by a die attach material. A third semiconductor die is coupled to the second semiconductor die by a die attach material. A second substrate having a plurality of electrically conductive patterns formed thereon is coupled to the third semiconductor die. A plurality of contacts is coupled to a bottom surface of the first substrate. A connector jack is coupled to the second substrate. A plurality of leads is coupled to the second semiconductor die by conductive wires.

REFERENCES:
patent: 6379193 (2002-04-01), Fujii et al.
patent: 6486544 (2002-11-01), Hashimoto
patent: 6590282 (2003-07-01), Wang et al.
patent: 6600222 (2003-07-01), Levardo
patent: 2004/0113253 (2004-06-01), Karnezos
patent: 2005/0001905 (2005-01-01), Shinomiya
patent: 05268535 (1993-10-01), None

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