Semiconductor package having a heat spreader capable of preventi

Details Semiconductor package having a heat spreader capable of preventi Semiconductor package having a heat spreader capable of preventi

1999-06-11

2000-07-25

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257666, 257675, 257712, 257713, 257717, 257720, 257796, 257762, 257766, 257788, 257790, H01L 2348, H01L 2944, H01L 2328

Patent

active

060939605

ABSTRACT:
A semiconductor package has a die and a plurality of leads electrically connected to the die with bonding wires. A heat spreader has an upper face thermally contacted with the die. The heat spreader is formed by a copper core having at least a portion of surface sequentially coated with a metal medium layer and an insulation layer, wherein the metal medium layer has an adhesion degree with insulation material higher than copper. A package body encapsulates the die, the heat spreader and the plurality of leads, wherein the surface area of the heat spreader that contacts with the package body is coated with the metal medium layer and the insulation layer.

REFERENCES:
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patent: 5596231 (1997-01-01), Combs
patent: 5608267 (1997-03-01), Mahulikar et al.
patent: 5650663 (1997-07-01), Parthasarathi
patent: 5814880 (1998-09-01), Costello et al.

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