Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1999-06-11
2000-07-25
Williams, Alexander Oscar
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257666, 257675, 257712, 257713, 257717, 257720, 257796, 257762, 257766, 257788, 257790, H01L 2348, H01L 2944, H01L 2328
Patent
active
060939605
ABSTRACT:
A semiconductor package has a die and a plurality of leads electrically connected to the die with bonding wires. A heat spreader has an upper face thermally contacted with the die. The heat spreader is formed by a copper core having at least a portion of surface sequentially coated with a metal medium layer and an insulation layer, wherein the metal medium layer has an adhesion degree with insulation material higher than copper. A package body encapsulates the die, the heat spreader and the plurality of leads, wherein the surface area of the heat spreader that contacts with the package body is coated with the metal medium layer and the insulation layer.
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Lo Kuang-Lin
Tao Su
Wei Hsin-Hsing
Advanced Semiconductor Engineering Inc.
Williams Alexander Oscar
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