LandOfFree - US Patents - Listing for Active solid-state devices (e.g., transistors, solid-state diode,Housing or package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging device for semiconductor die, semiconductor device...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging electrical circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Packaging for bare dice employing EMR-sensitive adhesives

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Packaging for electronic power devices and applications using th

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaging for enhanced thermal and structural performance of...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Packaging for high speed integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Packaging for multi-processor shared-memory system

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Packaging for semiconductor logic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Packaging method of a plurality of chips stacked on each...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging method, packaging structure and package substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With window means

Packaging microelectromechanical structures

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging micromechanical devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging mold with electrostatic discharge protection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Packaging multi-chip modules without wire-bond interconnection

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents

Packaging of electro-microfluidic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices

Packaging of hybrid integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material

Packaging of integrated circuits with carbon nanotube arrays...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging of MEMS devices using a thermoplastic

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package

Packaging of semiconductor device with a non-opaque cover