Packaging of semiconductor device with a non-opaque cover

Details Packaging of semiconductor device with a non-opaque cover Packaging of semiconductor device with a non-opaque cover

2006-02-21

2006-02-21

Lee, Eddie (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

C257S434000, C257S749000, C257S794000, C257S737000, C257S704000, C257S432000, C257S433000

Reexamination Certificate

active

07002241

ABSTRACT:
Packages of semiconductor devices with non-opaque covers and methods for making the packages. The invention allows an encapsulant to be used with a non-opaque cover. By ensuring the cover is attached to a die in such a way as to expose bonding pads while sealing in the imaging portion of the die, the die can be electrically connected to a substrate and then encapsulated. Since the imaging portion is sealed, the encapsulant cannot get underneath the glass. By ensuring the encapsulant is not filled beyond the glass, encapsulant cannot get over the glass either.

REFERENCES:
patent: 6428650 (2002-08-01), Chung
patent: 6492699 (2002-12-01), Glenn et al.
patent: 6667543 (2003-12-01), Chow et al.
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patent: 2003/0098912 (2003-05-01), Hosokai et al.
patent: 2004/0017537 (2004-01-01), Magana et al.
“ShellOP Process Flow,” Shellcase Wafer Level Packaging, Oct. 2001, 9 pages.
“ShellOP,” downloaded from http://www.shellcase.com/pages/products.asp on Nov. 19, 2002, 3 pages.
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“Dual Inline Package,” downloaded from http://www.tpub.com
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“An Innovative Approach to Wafer-Level MEMS packaging,” downloaded from: http://solidstate.articles.printthis.clickability.com on Nov. 19, 2002, 4 pages.
“Packaging Techniques,” downloaded from: http://www.tpub.com
eets/book14/57f.htm on Nov. 15, 2002.

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