Packaging for semiconductor logic devices

Details Packaging for semiconductor logic devices Packaging for semiconductor logic devices

1995-09-26

1999-12-28

Brown, Peter Toby

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257723, 257692, H01L 2348

Patent

active

RE036469&

ABSTRACT:
A logic module design is disclosed which incorporates an unencapsulated wafer section or sections. The disclosed module is an improvement over previous designs in that it is less expensive and easier to manufacture due to the reduced number of components and the complexity of the components, is faster and consumes less power because of its shorter trace lengths and smaller size, and is more reliable as a result of its greatly reduced number of interconnects.

REFERENCES:
patent: 4855809 (1989-08-01), Malhi et al.
patent: 4899107 (1990-02-01), Corbett et al.
patent: 4922378 (1990-05-01), Malhi et al.
patent: 4949163 (1990-08-01), Sudo et al.
patent: 4967262 (1990-10-01), Furnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5020999 (1991-06-01), DeWitt et al.

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