Packaging microelectromechanical structures

Details Packaging microelectromechanical structures Packaging microelectromechanical structures

2005-06-07

2005-06-07

Zarabian, Amir (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With window means

C257S724000, C257S778000

Reexamination Certificate

active

06903452

ABSTRACT:
A microelectromechanical system may be enclosed in a hermetic cavity defined by joined, first and second semiconductor structures. The joined structures may be sealed by a solder sealing ring, which extends completely around the cavity. One of the semiconductor structures may have the system formed thereon and an open area may be formed underneath said system. That open area may be formed from the underside of the structure and may be closed by covering with a suitable film in one embodiment.

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patent: 0 994 330 (2000-04-01), None
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Drayton et al.,Advanced Monolithic Packaging Concepts for High Performance Circuits and Antennas, 1996 IEEE MTT-S Intl. Microwave Symposium Digest, San Francisco, Jun. 17-21, 1996, IEEE MTT-S Intl. Microwave Symposium Digest, New York, IEEE, USA, vol. 3, pp. 1615-1618.
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