Packaging multi-chip modules without wire-bond interconnection

Details Packaging multi-chip modules without wire-bond interconnection Packaging multi-chip modules without wire-bond interconnection

1995-02-24

1997-03-04

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

For plural devices

257777, 257778, H01L 2334

Patent

active

056082622

ABSTRACT:
Described is a novel packaging of MCM tiles without wire-bond interconnections and in a total thickness which is reduced relative to conventional MCM packaging. The MCM tile includes a substrate with a plurality of peripheral metallizations and at least one chip flip-chip mounted on the substrate. The PWB is provided with an aperture which is smaller than the size of the silicon substrate but larger than the outside dimensions of the mounted chips. The substrate is positioned on the PWB so that its ends overlap areas of the PWB adjacent the aperture and the chips fit into the aperture. Peripheral metallizations on the substrate are interconnected to metallizations on the PWB by either solder reflow technology or conductive adhesive technology.

REFERENCES:
patent: 4903120 (1990-02-01), Beene et al.
F. Motika, Flip-Chip On Personalization Chip Carrier Package Dec. 1980 pp. 2770-2773.
Patent No. 5,346,118, filed on Sep. 28, 1993 and issued on Sep. 13, 1994 to Yinon Degani, Thomas D. Dudderar & William L. Woods, Jr.
"Overmolded Plastic Pad Array Carriers (OMPAC): A Low Cost, High Interconnect Density IC Packaging Solution for Consumer and Industrial Electronics" by Bruce Freyman and Robert Pennisi, which article appeared in 41st Electronic Components and Technology Conference, Book B, No. 502920 Atlanta, GA, pp. 176-182. no date.
"A Mixed solder Grid Array and Peripheral Leaded MCM Package" by Hashemi, H., Olla, M, Cobb, D., and Sandborn, P, Journal: Proc Electron Compon Technol Conf., Orlando, Florida, 1993, pp. 951-956. no month.

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