Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate
2005-12-20
2010-12-07
Parker, Kenneth A (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
C257S712000, C257S720000, C257S713000, C257S778000, C257S796000, C361S689000, C361S709000, C361S689000, C361S708000, C361S713000, C165S185000, C165S104330, C165S080300
Reexamination Certificate
active
07847394
ABSTRACT:
According to one aspect of the invention, a method of constructing an electronic assembly is provided. A layer of metal is formed on a backside of a semiconductor wafer having integrated formed thereon. Then, a porous layer is formed on the metal layer. A barrier layer of the porous layer at the bottom of the pores is thinned down. Then, a catalyst is deposited at the bottom of the pores. Carbon nanotubes are then grown in the pores. Another layer of metal is then formed over the porous layer and the carbon nanotubes. The semiconductor wafer is then separated into microelectronic dies. The dies are bonded to a semiconductor substrate, a heat spreader is placed on top of the die, and a semiconductor package resulting from such assembly is sealed. A thermal interface is formed on the top of the heat spreader. Then a heat sink is placed on top of the thermal interface.
REFERENCES:
patent: 5102824 (1992-04-01), Neugebauer et al.
patent: 5316080 (1994-05-01), Banks et al.
patent: 5604037 (1997-02-01), Ting et al.
patent: 5780101 (1998-07-01), Nolan et al.
patent: 5825624 (1998-10-01), Arnold et al.
patent: 5837081 (1998-11-01), Ting et al.
patent: 5965267 (1999-10-01), Nolan et al.
patent: 5972265 (1999-10-01), Marra et al.
patent: 6129901 (2000-10-01), Moskovits et al.
patent: 6156256 (2000-12-01), Kennel
patent: 6232706 (2001-05-01), Dai et al.
patent: 6283812 (2001-09-01), Jin et al.
patent: 6303094 (2001-10-01), Kusunoki et al.
patent: 6312303 (2001-11-01), Yaniv et al.
patent: 6325909 (2001-12-01), Li et al.
patent: 6350488 (2002-02-01), Lee et al.
patent: 6361861 (2002-03-01), Gao et al.
patent: 6383923 (2002-05-01), Brown et al.
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6420293 (2002-07-01), Chang et al.
patent: 6440761 (2002-08-01), Choi
patent: 6445006 (2002-09-01), Brandes et al.
patent: 6495258 (2002-12-01), Chen et al.
patent: 6504292 (2003-01-01), Choi et al.
patent: 6528020 (2003-03-01), Dai et al.
patent: 6531828 (2003-03-01), Yaniv et al.
patent: 6595906 (2003-07-01), Smith
patent: 6617682 (2003-09-01), Ma et al.
patent: 6628053 (2003-09-01), Den et al.
patent: 6630772 (2003-10-01), Bower et al.
patent: 6651736 (2003-11-01), Chiu et al.
patent: 6667548 (2003-12-01), O'Connor et al.
patent: 6705152 (2004-03-01), Routkevitch et al.
patent: 6737939 (2004-05-01), Hoppe et al.
patent: 6741019 (2004-05-01), Filas et al.
patent: 6856016 (2005-02-01), Searls et al.
patent: 6858521 (2005-02-01), Jin
patent: 6891724 (2005-05-01), De Lorenzo et al.
patent: 6921462 (2005-07-01), Montgomery et al.
patent: 6946597 (2005-09-01), Sager et al.
patent: 6965513 (2005-11-01), Montgomery et al.
patent: 7019391 (2006-03-01), Tran
patent: 7112472 (2006-09-01), Dubin
patent: 7168484 (2007-01-01), Zhang et al.
patent: 7301191 (2007-11-01), Tombler et al.
patent: 7316061 (2008-01-01), Dubin et al.
patent: 7704791 (2010-04-01), Dubin et al.
patent: 2001/0009693 (2001-07-01), Lee et al.
patent: 2001/0024633 (2001-09-01), Lee et al.
patent: 2002/0105071 (2002-08-01), Mahajan et al.
patent: 2002/0145194 (2002-10-01), O'Conner et al.
patent: 2002/0158331 (2002-10-01), Umehara et al.
patent: 2002/0172767 (2002-11-01), Grigorian et al.
patent: 2002/0197752 (2002-12-01), Choi
patent: 2003/0064169 (2003-04-01), Hong et al.
patent: 2003/0117770 (2003-06-01), Montgomery et al.
patent: 2003/0135971 (2003-07-01), Liberman et al.
patent: 2003/0143398 (2003-07-01), Ohki et al.
patent: 2003/0179559 (2003-09-01), Engelhardt et al.
patent: 2003/0231471 (2003-12-01), De Lorenzo et al.
patent: 2004/0005736 (2004-01-01), Searls et al.
patent: 2004/0097635 (2004-05-01), Fan et al.
patent: 2004/0118129 (2004-06-01), Chrysler et al.
patent: 2004/0137730 (2004-07-01), Kim et al.
patent: 2004/0150100 (2004-08-01), Dubin et al.
patent: 2004/0188829 (2004-09-01), Hu et al.
patent: 2004/0265489 (2004-12-01), Dubin
patent: 2004/0266065 (2004-12-01), Zhang et al.
patent: 2005/0276093 (2005-12-01), Harutyunyan
patent: 2006/0054490 (2006-03-01), Montgomery et al.
patent: 2006/0128137 (2006-06-01), Furukawa et al.
patent: 2006/0231946 (2006-10-01), Pan et al.
patent: 2007/0116632 (2007-05-01), Harutyunyan
patent: 2007/0137697 (2007-06-01), Ohki et al.
patent: 0 538 798 (1993-04-01), None
patent: 0 689 244 (1995-12-01), None
patent: 1 054 036 (2000-04-01), None
patent: 1 109 218 (2001-06-01), None
patent: 10-2002-0038035 (2002-05-01), None
patent: WO 01/30694 (2001-05-01), None
patent: WO 00/33628 (2001-06-01), None
patent: WO 01/92381 (2001-12-01), None
Chen, J.H. et al., “Exploratory Research on Carbon Nanotube Arrays as Nanoelectrodes for Use in Electrochemistry”, Proceedings of the 199.sup.th Meeting of Electrochemical Society, Washington DC, USA, Mar. 2001, pp. 1-4.
Teo, K. B. K. et al., “Uniform Patterned Growth of Carbon Nanotubes without Surface Carbon”, Applied Physics Letters, 2001 American Institute of Physics, vol. 79, No. 10, Sep. 2001, pp. 1534-1536.
Chhowalla, M. et al., “Growth Process Conditions of Vertically Aligned Carbon Nanotubes Using Plasma Enhanced Chemical Vapor Deposition” Applied Physics Letters, 2001 American Institute of Physics, vol. 90, No. 10, Nov. 2001, pp. 5308-5317.
Ducati, C. et al., “Temperature Selective Growth of Carbon Nanotubes by Chemical Vapor Deposition”, Applied Physics Letters, 2001 American Institute of Physics, vol. 92, No. 6, Sep. 2002, pp. 3299-3303.
“Growth of Carbon Nanotube”, Nanomaterials Science and Engineering, Materials Science & Engineering, Rutgers University, http://mse.rutgers.edu/NMSE/cntgrowht.php, May 18, 2007.
“Nanofab Tools and Processes for Nanostructure Growth”, Oxford Instruments, http://www.oxinst.com, May 18, 2007.
“Aligned Carbon Nanotube Arrays”, NanoLab Aligned Carbon Nanotube Arrays, Nanotube Arrays, http://www.nano-lab.com/aligned/carbonnanotubearrays.html, May 18, 2007.
The NanoGrowth.TM. PECBD Tool for Low-Temperature Growth of Nanomaterials, CEVP Tools for Sputtering & Nanomaterial Growth, http://www.cevp.co.uk
anogrowth.sub—pecvd.htm, May 18, 2007.
RF-PECVD of Carbon Nanotube, EDM Group: Research—Nanotubes—RF-PECVD Growth, Department of Engineering, http://www-g.eng.cam.ac.uk/edm/research
anotubes/rfpecvd.html, May 18, 2007.
Carbon Solutions Inc., http:/www.carbonsolutiond.com, May 18, 2007.
R.J. Beller, et al, “High Conduction Thermal Interface Material,” IBM Technical Disclosure Bulletin, vol. 36, No. 10, pp. 581-583 (Oct. 1, 1993).
Zhang, Y. , et al., “Formation of metal nanowires on suspended single-walled carbon nanotubes”, Applied Physics Letters, 77(19), (Nov. 6, 2000), 3015-3017.
Andrews, R., “Nanotube Composite Carbon Fibers”, Applied Physics Letters, 75, (Aug. 30, 1999), 1329-1331.
J. Li, et al., “Highly-Ordered Carbon Nanotube Arrays for Electronics Applications,” Applied Physics Letters, vol. 75, No. 3, pp. 367-369 (Jul. 19, 1999).
B.Q. Wei, et al., “Organized Assembly of Carbon Nanotubes,” Nature, vol. 416, Macmillan Magazines Ltd., pp. 495-496 (Apr. 4, 2002).
C. Papadopoulos, et al., “Electronic Transport in Y-Junction Carbon Nanotubes,” Physical Review Letters, vol. 85, No. 16, The American Physical Society, pp. 3476-3479 (Oct. 16, 2000).
J. Li, et al., “Growing Y-Junction Carbon Nanotubes,” Nature, vol. 402, Macmillan Magazines Ltd., pp. 253-254 (Nov. 18, 1999).
P. Avouris, et al., “Carbon Nanotube Electronics,” Abstract No. 52, Philadelphia meeting abstracts vol. 2002-1, 201st Meeting of The Electrochemical Society, Philadelphia, PA, 3 pgs. (May 2002).
Z.J. Zhang, et al., “Substrate-Site Selective Growth of Aligned Carbon Nanotubes,” Applied Physics Letters, vol. 77, No. 23, American Institute of Physics, pp. 3764-3766 (Dec. 4, 2000).
C. Bower, et al., “Plasma-Induced Alignment of Carbon Nanotubes,” Applied Physics Letters, vol. 77, No. 6, American Institute of Physics, pp, 830-832 (Aug. 7, 2000).
S. Fan, et al., “Self-Oriented Regular Arrays of
Dory Thomas S.
Dubin Valery M
Blakely , Sokoloff, Taylor & Zafman LLP
Intel Corporation
Nguyen Joseph
Parker Kenneth A
LandOfFree
Packaging of integrated circuits with carbon nanotube arrays... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging of integrated circuits with carbon nanotube arrays..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging of integrated circuits with carbon nanotube arrays... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4203335