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Packaged semiconductor die including heat sink with locking feat

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
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Packaged stacked semiconductor die and method of preparing same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Packages base which allows mounting of a semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Packages for communication devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packages for electronic devices implemented with laminated...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Packages for encapsulated semiconductor devices and method...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Packages for semiconductor die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packages for semiconductor integrated circuit

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Packages formed by attaching a semiconductor chip to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Packaging and cooling system for power semi-conductor

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Packaging and interconnect system for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Packaging and interconnect system for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Smart card package
Patent

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Packaging and interconnect system for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Packaging and interconnection of contact structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Packaging arrangement for power semiconductor devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Packaging assembly with consolidated common voltage connections

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Packaging chip and packaging method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Packaging component and semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packaging conductive structure for a semiconductor substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Packaging construction for very large scale integrated-circuit c

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent

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