Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent
1991-05-29
1994-05-24
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
257704, 257710, H01L 2328
Patent
active
053151534
DESCRIPTION:
BRIEF SUMMARY
INDUSTRIAL FIELD OF THE INVENTION
The present invention relates to a package for semiconductor integrated circuit.
PRIOR ART AND PROBLEMS THEREOF
Conventional methods for fabricating a ceramics package generally comprise forming a specific wiring on green sheets, calcining the combination of green sheets, adhereing each lead to the side surface, bottom surface and other portions of the calcined package, electroplating the leads and the wiring portion, and sealing the package with a resin (see, e.g., Japanese Examined Utility Model Publication No. 8361/1984.).
However, such methods entail the following problems. The methods comprise a great number of steps and a low yield results at each step. For production of a package having many pins, the method involves more complicated steps, and thus entails difficulty in providing products at low costs.
On PLCC, flat packages and other thin packages including numerous pins, the water present in the resin used for sealing and the moisture in the air gradually permeate into IC chips, posing problems of, e.g., insufficiency in resistance to water.
Further disadvantageously, since it is necessary to calcine the green sheets at a high temperature of 1000.degree. C. or higher, noble metal-based materials, rare earth type materials or like expensive materials must be used as materials for wiring.
For users' part, the following additional drawback exists. An expensive ceramics package must be used even when a high reliability and a high thermal conductivity among the characteristics of ceramics packages are not always needed, but only a high thermal conductivity is essentially utilized.
MEANS FOR SOLUTION OF THE PROBLEMS
We conducted extensive research in view of the foregoing current state of the prior art. Consequently, we found that the prior art problems can be considerably alleviated by the following technique. A lead frame or a flexible printing board is adhered to a ceramics substrate with a resin layer, a semiconductor integrated circuit is formed on the ceramics substrate in the conventional manner, and the hollow space surrounding the semiconductor integrated circuit is sealed with a cap.
The present invention provides a ceramics package for a semiconductor integrated circuit, the package comprising:
a ceramics substrate,
a semiconductor integrated circuit formed on the ceramics substrate,
a lead frame or a flexible printing board attached with a resin layer to the ceramics substrate, and
a hollow space surrounding the semiconductor integrated circuit which space is sealed with a cap.
EXAMPLES
The present invention will be described below in more detail with reference to the following embodiments which are shown in the accompanying drawings.
FIG. 1 is a sectional view schematically showing an embodiment of the package for semiconductor integrated circuit according to the invention;
FIG. 2 is a sectional view schematically showing another embodiment of the package for semiconductor integrated circuit according to the invention; and
FIG. 3 is a sectional view schematically showing a further embodiment of the package for semiconductor integrated circuit according to the invention.
In FIG. 1, a substrate 1 is made of ceramics and has fins 3 when so required. A lead frame 5 is adhered to the substrate 1 with a resin layer 7 to form a hollow space 15. The materials for the ceramics substrate 1 can be those known, and include, for example, aluminum nitride, alumina, boron nitride, beryllia, silicon nitride, etc. Usable as the material for the lead frame 5 are copper, copper alloy, iron, iron alloy (e.g. 42 alloy) and the like. Useful materials for the resin layer 7 can be those used for sealing a semiconductor device, such as epoxy resin, phenolic resin, polyimide resin, silicone resin, fluoro plastics, polybutadiene, polyester resin, polyphenylene sulfide resin, etc. An alternative to the lead frame 5 is a flexible printing board having wiring formed on a plastics sheet (e.g. polyimide sheet).
The ceramics substrate 1 to which the lead frame 5 is attached as a
REFERENCES:
patent: 4729010 (1988-03-01), Tsuchiya et al.
patent: 4965660 (1990-10-01), Ogihara et al.
patent: 5055914 (1991-10-01), Shimuzu et al.
patent: 5072284 (1991-12-01), Tamura et al.
patent: 5117281 (1992-05-01), Katsuraoka
Kato Kazushige
Nagai Yuji
Ohshima Hisao
Tanikawa Eiki
Hille Rolf
Kabushiki Kaisha Enplas
Potter Roy
Toyo Aluminium Kabushiki Kaisha
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