Packaging chip and packaging method thereof

Details Packaging chip and packaging method thereof Packaging chip and packaging method thereof

2006-03-28

2008-08-05

Clark, S. V (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S704000

Reexamination Certificate

active

07408257

ABSTRACT:
A packaging chip in which a circuit module is packaged and a method of packaging a circuit module are provided. The packaging chip includes a base wafer; a circuit module on the base wafer; a packaging wafer having a cavity and combined with the base wafer so that the circuit module fits inside the cavity; a connecting electrode connecting upper and lower surfaces of the cavity; and a seed layer between the connecting electrode and the packaging wafer. The method includes etching a lower surface of the packaging wafer to form a cavity, stacking a metal layer in an area of the lower surface, combining the base wafer with the packaging wafer, polishing the packaging wafer, forming a viahole through the packaging wafer, stacking a seed layer on the packaging wafer, plating the inside of the viahole, removing the seed layer and forming an electrode.

REFERENCES:
patent: 5331203 (1994-07-01), Wojnarowski et al.
patent: 5723904 (1998-03-01), Shiga
patent: 5757072 (1998-05-01), Gorowitz et al.
patent: 6583513 (2003-06-01), Utagikar et al.
patent: 6777263 (2004-08-01), Gan et al.
patent: 7115961 (2006-10-01), Watkins et al.
patent: 2007/0049016 (2007-03-01), Hiatt et al.
patent: 2007/0085195 (2007-04-01), Lee et al.

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