Packaging assembly with consolidated common voltage connections

Details Packaging assembly with consolidated common voltage connections Packaging assembly with consolidated common voltage connections

1994-10-25

1996-12-03

Mintel, William

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257700, 257738, H01L 2352

Patent

active

055811221

ABSTRACT:
An IC dice mounted on a substrate carrier wherein the IC dice is connected by a plurality of bonding wires to a plurality of corresponding bonding pads on the substrate carrier. The wire bonding layout configuration of the electronic device is improved in the present invention by providing centralized consolidated common voltage pads or bars such that the electric wires connecting the bonding pads to external interface contact points, e.g., the ball grid array (BGA) may be shortened. Additionally, the access widow for wire bonding to the IC dice may be broadened.

REFERENCES:
patent: 5173767 (1992-12-01), Lange et al.
patent: 5285352 (1994-02-01), Pastore et al.
patent: 5402318 (1995-03-01), Otsuka et al.
patent: 5442230 (1995-08-01), Chillara et al.

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