Packages base which allows mounting of a semiconductor...

Details Packages base which allows mounting of a semiconductor... Packages base which allows mounting of a semiconductor...

2007-04-10

2007-04-10

Owens, Douglas W. (Department: 2811)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

C257S713000, C257S724000, C257S712000, C257S784000

Reexamination Certificate

active

10131465

ABSTRACT:
A package base for a semiconductor element is made of a carbon composite material. The mounting surface of the package base includes a first area on which at least one first element including at least one semiconductor element is to be mounted, and a second area on which at least one second element including at least a terminal for electrode wiring is to be mounted. Preferably, the carbon composite material is a high-density, isotropic carbon-fiber composite material. In addition, the mounting surface may have a step change in surface elevation for alignment of either of the at least one first element and the at least one second element.

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