Packaging arrangement for power semiconductor devices

Details Packaging arrangement for power semiconductor devices Packaging arrangement for power semiconductor devices

1993-04-08

1994-05-17

Hille, Rolf

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With provision for cooling the housing or its contents

257714, 174 163, H01L 2504

Patent

active

053130987

ABSTRACT:
A two-sided hermetically sealed package of a metal matrix composite material includes a heat sink and integral cooling fins on each of the two sides which are totally enclosed to retain cooling fluid. Power semiconductors are mounted on ceramic substrates having metallic conductors mounted on both sides thereof. The substrates are mounted to the heat sinks. Cooling is provided by the passage of cooling fluid into one end of the enclosed fins, over the fins and out the other end. The metal matrix composite material and the ceramic are thermally matched and the package is provided with a minimum number of thermal interfaces.

REFERENCES:
patent: 4009423 (1977-02-01), Wilson
patent: 5111280 (1992-05-01), Iversen
patent: 5168348 (1992-12-01), Chu et al.

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