Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Entirely of metal except for feedthrough
Patent
1989-01-30
1999-11-02
Sotomayor, John B.
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Entirely of metal except for feedthrough
438106, 438121, 438122, 438125, 257702, 257784, H01L 2302, H01L 2144, H01L 2150
Patent
active
059776277
ABSTRACT:
A novel IC chip packaging construction in which the chip package materials are selected such that their thermal linear expansion curves are closely matched over the full operating temperature range of the IC chip. The IC chip packaging construction includes a metal base and cover for enclosing the IC chip and a pair of insulating frames for hermetically sealing the IC chip in the chip package. A plurality of input/output leads make electrical connections with the IC chip through fine wires that are soldered to the leads and to contact areas on the IC chip. The metal base and cover and the input/output leads are fabricated from copper and the insulating frames are fabricated from Fotoceram.RTM. 160, which has a thermal linear expansion curve that closely matches that of copper over the full operating temperature range of the chip. Accordingly, the problems of differential expansion rates due to temperature variations for wafer size or very large scale IC chips are greatly minimized.
REFERENCES:
patent: 3769560 (1973-10-01), Miyake et al.
patent: 4225900 (1980-09-01), Cicci et al.
patent: 4491622 (1985-01-01), Butt
patent: 4535219 (1985-08-01), Sliwa, Jr.
patent: 4563541 (1986-01-01), Lebailly et al.
Sotomayor John B.
TRW Inc.
Yatsko Michael S.
LandOfFree
Packaging construction for very large scale integrated-circuit c does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Packaging construction for very large scale integrated-circuit c, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging construction for very large scale integrated-circuit c will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2139250